INTRODUCTION TO THE COM SERIES
COM is a name of communication converters that make communication of our
controllers easier.There are two types of COM converters; one is for communication
level converter and the other is a communication protocol converter. Please
select whichever is suitable for your applications.
COMMUNICATION LEVEL CONVERTER
COM-A : RS-232/422 Converter
COM-B : RS-232/485 Converter (For use with MS-DOS only)
COMMUNICATION PROTOCOL CONVERTER
COM-E
Automatically converts the protocol used in RKC controllers (REX-F, CB
Series, SA200, and LE100) into the PLC protocol and writes the data into
the PLC's registers. This eliminates the need for communication program
development on the PLC side.
COM-G
Converts protocols between RKC standard/ANSI and Profibus.
Converts the protocol used in RKC controllers
(REX-F, CB series, SA200, LE100) into the
Profibus-DP protocol. This makes RKC controllers
work as a slave of Profibus-DP.
COM-H
This is a communication protocol converter between SR Mini multi-loop
controllers and PLC that are connected via DeviceNet, and converts
protocols between RKC standard/ANSI and DeviceNet.
Profibus-DP: is used in time-critical applications between an automation
system and distributed devices (remote I/O, inverter, etc.). Profibus-DP
is also defined as IEC61158 and EN50170.
DeviceNet is a low-cost industrial network to connect
industrial devices such as limit switches, photoelectric cells, valve manifolds, motor
starters, drives, and operator displays to PLCs and PCs. The network eliminates expensive
hard-wiring while providing device-level diagnostics. ODVA
is the organization that manages the DeviceNet technology and promotes the worldwide
adoption of DeviceNet in industrial automation.
THE SYNERGETIC FIELDBUS COMPARISON CHART
BACKGROUND INFORMATION
|
| Fieldbus Name |
Technology Developer |
Year Introduced |
Governing Standard |
Openness |
| PROFIBUS
DP/PA |
Siemens |
DP-1994, PA-1995 |
EN 50170 / DIN 19245 part 3(DP) /4 (PA), IEC
1158-2 (PA) |
ASICs from Siemens and Profichip, Products from
over 300 vendors |
| INTERBUS-S |
Phoenix Contact, Interbus Club |
1984 |
DIN 19258
EN 50.254 |
Products from over
400 manufacturers |
| DeviceNet |
Allen-Bradley |
March 1994 |
ISO 11898 &11519 |
17 chip vendors, 300+ product vendors, Open
specification |
| ARCNET |
Datapoint |
1977 |
ANSI/ATA 878.1 |
Chips, boards, ANSI docs |
| AS-I |
AS-I Consortium |
Fall 1993 |
Submitted to IEC |
AS-II.C. Market item |
| Foundation Fieldbus H1 |
Fieldbus Foundation |
1995 |
ISA SP50/IEC 61158 |
Chips/software/products from multiple vendors |
| Foundation Fieldbus High Speed Ethernet (HSE) |
Fieldbus Foundation |
In development - lab test phase, Prelim spec available to
members |
IEEE 802.3u
RFC for IP, TCP & UDP |
Multitude of suppliers for Ethernet components, Extremely low
cost |
IEC/ISA SP50
Fieldbus |
ISA & Fieldbus F. |
1992 - 1996 |
IEC 1158/ANSI 850 |
Multiple chip vendors |
| Seriplex |
APC, Inc. |
1990 |
Seriplex spec |
Chips available multiple interfaces |
| WorldFIP |
WorldFIP |
1988 |
IEC 1158-2 |
Multiple chip vendors |
| LonWorks |
Echelon Corp. |
March 1991 |
--- |
Public documentation on protocol |
| SDS |
Honeywell |
Jan., 1994 |
Honeywell Specification, Submitted to IEC,
ISO11989 |
17 chip vendors,
100+ products |
| ControlNet |
Allen-Bradley |
1996 |
ControlNet International |
Open Specification, 2 Chip Vendors |
| CANopen |
CAN In Automation |
1995 |
CiA |
17 chip vendors, 300 product vendors, Open specification |
| Ethernet |
DEC, Intel, Xerox |
1976 |
IEEE 802.3, DIX v. 2.0 |
Multitudes of Chips and Products |
| Modbus Plus |
Modicon |
--- |
--- |
Proprietary, requires license/ASICs |
| Modbus RTU/ASCII |
Modicon |
--- |
EN 1434-3 (layer 7)
IEC 870-5 (layer 2) |
Open specification, no special hardware required |
| Remote I/O |
Allen-Bradley |
1980 |
--- |
Proprietary |
| Data Highway Plus (DH+) |
Allen-Bradley |
--- |
--- |
Proprietary |
Source: Fieldbus Comparison Chart - http://www.synergetic.com/compare.htm